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Reference, Title | Downloads |
Circulation Date |
Closing Date |
CENELEC | Voting / Comment | Of interest to Committees |
|---|---|---|---|---|---|---|
| 47/2854/AC Next meeting of TC 47 and Subcommittees of 47A, 47D, 47E and 47F and associated working groups to be held in London, United Kingdom from 2024-11-25 to 2024-11-29 with the option to participate remotely | 2024-06-07 | N/A | ||||
| 47/2853/AC Next meeting of TC 47 and Subcommittees of 47A, 47D, 47E and 47F and associated working groups to be held in London, United Kingdom from 2024-11-25 to 2024-11-29. (Announcement) | 2024-05-31 | N/A | ||||
| 47/2852/AC JAHG 9: MSB White Paper on Power semiconductors for an energy wise society (SMB Decision 179/11) ? Call for experts | 2024-05-17 | 2024-06-14 | N/A | TC 9 TC 17 TC 22 TC 23 TC 69 TC 82 TC 88 TC 91 TC 120 TC 121 | ||
| 47/2847/NP PNW 47-2847 ED1: Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light | 2024-05-10 | 2024-08-02 | U | |||
| 47/2848/NP PNW 47-2848 ED1: Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process | 2024-05-10 | 2024-08-02 | U | |||
| 47/2849/RVN Result of Voting on 47/2816/NP - PNW 47-2816 ED1: The recognition criteria of defects in polished indium phosphide wafers | 2024-05-10 | E | ||||
| 47/2850/RVN Result of Voting on 47/2817/NP - PNW 47-2817 ED1: Non-destructive recognition criteria of defects in silicon carbide hom*oepitaxial wafer for power devices | 2024-05-10 | E | ||||
| 47/2851/RVC Result of Voting on 47/2825/CDV - IEC 63150-2 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 2: Human arm swing motion | 2024-05-10 | N | ||||
| 47/2846/RVN Result of Voting on 47/2824/NP - PNW 47-2824 ED1: Semiconductor devices ? Performance evaluation of semiconductor components and equipment ? Part 1: Transmittance evaluation method of EUV pellicle | 2024-04-05 | Y | ||||
| 47/2843/NP PNW 47-2843 ED1: Semiconductor devices - Detection modules of autonomous land vehicle - Part 4: Testing methods of performance for millimeter-wave radar | 2024-03-29 | 2024-06-21 | U | |||
| 47/2844/NP PNW 47-2844 ED1: Semiconductor devices - Detection modules of autonomous land vehicle - Part 5: Testing methods of performance for ultrasonic modules | 2024-03-29 | 2024-06-21 | U | |||
| 47/2845/NP PNW 47-2845 ED1: Semiconductor devices - Detection modules of autonomous land vehicle - Part 6: Testing methods of performance for visual imaging modules | 2024-03-29 | 2024-06-21 | U | |||
| 47/2842/CD IEC TR 63571 ED1: Estimation Method for Lifetime Conversion from ?PART? to ?SYSTEM? | 2024-03-22 | 2024-06-14 | N | |||
| 47/2841/RQ Result of Questionnaire on 47/2831/Q: Nomination of representative to ACEA (Advisory Committee on Environmental Aspects) | 2024-03-08 | N/A | ||||
| 47/2840/NP PNW 47-2840 ED1: IEC 63XXX-1 for SEMICONDUCTOR DEVICES - Reliability evaluation methods for vibration energy harvesters - Part 1 : Mechanical reliability under shock | 2024-02-16 | 2024-05-10 | U | Voting Result | ||
| 47/2839/RM Unconfirmed minutes of TC 47 plenary meeting held in Frankfurt, Germany on 2023-11-17 | 2024-02-09 | N/A | ||||
| 47/2835/NP PNW 47-2835 ED1: Future IEC 63287-4: Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment | 2024-02-02 | 2024-04-26 | U | Voting Result | ||
| 47/2836/RVN Result of Voting on 47/2811/NP - PNW 47-2811 ED1: Future IEC XXXXX-2: Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices | 2024-02-02 | Y | ||||
| 47/2837/RVN Result of Voting on 47/2813/NP - PNW 47-2813 ED1: Future IEC XXXXX-4: Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in neuromorphic memristor devices | 2024-02-02 | Y | ||||
| 47/2838/RVN Result of Voting on 47/2812/NP - PNW 47-2812 ED1: Future IEC XXXXX-3: Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices | 2024-02-02 | Y | ||||
| 47/2825/CDV IEC 63150-2 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 2: Human arm swing motion | 2024-01-26 | 2024-04-19 | N | Voting Result | ||
| 47/2832/CC Compilation of Comments on 47/2815/CD - IEC 63287-3 ED1: Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module | 2024-01-26 | Y | ||||
| 47/2833/RVN Result of Voting on 47/2810/NP - PNW 47-2810 ED1: Future IEC XXXXX-1: Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices | 2024-01-26 | Y | ||||
| 47/2834/RVN Result of Voting on 47/2818/NP - PNW 47-2818 ED1: Future IEC XXXXXX ED.1 Semiconductor devices - Detection modules of autonomous land vehicle - Part 1:Testing methods of detection performance for LiDAR | 2024-01-26 | Y | ||||
| 47/2829/Q Naming discussion regarding a new test proposed within IEC TC 47/WG 8 (Wide bandgap technologies - Power electronic conversion) | 2024-01-19 | 2024-03-01 | N/A | Report of Comments | ||
| 47/2830/Q Withdrawn | 2024-01-19 | N/A | ||||
| 47/2831/Q Nomination of representative to ACEA (Advisory Committee on Environmental Aspects) | 2024-01-19 | 2024-03-01 | N/A | Report of Comments | ||
| 47/2823/CDV IEC 60749-34-1 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module | 2023-12-22 | 2024-03-15 | Y | Voting Result | ||
| 47/2826/RVC Result of Voting on 47/2808/CDV - IEC 63150-3 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion | 2023-12-08 | E | ||||
| 47/2827/RVD Result of Voting on 47/2820/FDIS - IEC 60749-5 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-12-08 | Y | TC 104 | |||
| 47/2828/DL List of decisions taken at the meeting of TC 47 held in Frankfurt, Germany on 2023-11-17. | 2023-12-08 | N/A | ||||
| 47/2824/NP PNW 47-2824 ED1: Semiconductor devices ? Performance evaluation of semiconductor components and equipment ? Part 1: Transmittance evaluation method of EUV pellicle | 2023-12-01 | 2024-02-23 | Y | Voting Result | ||
| 47/2809A/AC Next meeting of TC 47 and its Subcommittees 47A, 47D, 47E, 47F and associated working groups to be held in Frankfurt, Germany from 2023-11-13 to 2023-11-17 (online registration) | 2023-11-03 | N/A | ||||
| 47/2820(F)/FDIS IEC 60749-5 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-10-27 | 2023-11-10 | Y | Voting Result | TC 104 | |
| 47/2822/AC Call for nominations for the Chair of TC 47: Semiconductor devices | 2023-10-27 | 2024-01-19 | N/A | Report of Comments | ||
| 47/2819A/DA Revised draft agenda for the meeting to be held in Frankfurt, Germany on November 17th 2023 (starting time: 9:00 am to approximate finishing time: 12:00 noon) | 2023-10-20 | N/A | ||||
| 47/2821/INF Review of Active Participation of P-members in the Work of TC 47 | 2023-10-20 | N/A | ||||
| 47/2784B/CC Revised Compilation of Comments on 47/2759/CD - IEC 60749-34-1 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module | 2023-10-13 | Y | ||||
| 47/2820/FDIS IEC 60749-5 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-09-29 | 2023-11-10 | Y | Voting Result | TC 104 | |
| 47/2814/CDV IEC 63512 ED1: Test method for continuous-switching evaluation of gallium nitride power conversion devices | 2023-09-22 | 2023-12-15 | N | Voting Result | TC 91 TC 104 | |
| 47/2818/NP PNW 47-2818 ED1: Future IEC XXXXXX ED.1 Semiconductor devices - Detection modules of autonomous land vehicle - Part 1:Testing methods of detection performance for LiDAR | 2023-09-15 | 2023-12-08 | Y | Voting Result | ||
| 47/2819/DA Replaced by 47/2819A/DA | 2023-09-15 | N/A | ||||
| 47/2816/NP PNW 47-2816 ED1: The recognition criteria of defects in polished indium phosphide wafers | 2023-09-08 | 2023-12-01 | E | Voting Result | ||
| 47/2817/NP PNW 47-2817 ED1: Non-destructive recognition criteria of defects in silicon carbide hom*oepitaxial wafer for power devices | 2023-09-08 | 2023-12-01 | E | Voting Result | ||
| 47/2798A/AC Call for nomination of TC representative to the ACEA | 2023-08-25 | 2023-10-06 | N/A | Report of Comments | ||
| 47/2784A/CC Revised Compilation of Comments on 47/2759/CD - IEC 60749-34-1 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module | 2023-08-11 | Y | ||||
| 47/2815/CD IEC 63287-3 ED1: Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module | 2023-08-11 | 2023-11-03 | Y | Report of Comments | ||
| 47/2808/CDV IEC 63150-3 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion | 2023-07-28 | 2023-10-20 | E | Voting Result | ||
| 47/2806/CDV IEC 63505 ED1: Guidelines for measuring the threshold voltage (VT) of SiC MOSFETs | 2023-07-21 | 2023-10-13 | N | Voting Result | TC 91 TC 104 | |
| 47/2810/NP PNW 47-2810 ED1: Future IEC XXXXX-1: Semiconductor devices - Neuromorphic devices - Part 1: Evaluation method of basic characteristics in memristor devices | 2023-07-21 | 2023-10-13 | Y | Voting Result | ||
| 47/2811/NP PNW 47-2811 ED1: Future IEC XXXXX-2: Semiconductor devices - Neuromorphic devices - Part 2: Evaluation method of linearity in memristor devices | 2023-07-21 | 2023-10-13 | Y | Voting Result | ||
| 47/2812/NP PNW 47-2812 ED1: Future IEC XXXXX-3: Semiconductor devices - Neuromorphic devices - Part 3: Evaluation method of spike dependent plasticity in memristor devices | 2023-07-21 | 2023-10-13 | Y | Voting Result | ||
| 47/2813/NP PNW 47-2813 ED1: Future IEC XXXXX-4: Semiconductor devices - Neuromorphic devices - Part 4: Evaluation method of asymmetry in neuromorphic memristor devices | 2023-07-21 | 2023-10-13 | Y | Voting Result | ||
| 47/2809/AC Replaced by 47/2809A/AC | 2023-06-16 | N/A |
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